Spring Contact Finger
Spring contact finger, 0.10–2.0 mm wire diameter, silver plated in copper alloy or stainless steel; size per attached dimensional drawing, customizable.
Specifications
- Materials
- Stainless steel, BRASS, Copper alloy
- Plating
- Silver, Tin
- Minimum wire Ø
- 0.10 mm (min), 2.0 mm (max)
Description
This spring contact finger is manufactured to a wire diameter of 0.10–2.0 mm in silver-plated copper alloy or stainless steel. Its reference image is the technical dimensional drawing and specification table for canted coil spring ring sizes, so the part is quoted and produced against the customer's attached drawing rather than a fixed catalogue bore. Overall size, plating specification and base material can be customized to the application.
Sizing and Finish
Wire diameter 0.10–2.0 mm. Plating silver. Material copper alloy or stainless steel. Because production follows the supplied drawing, the finger can be tailored to a specific mating jack, and plating and material can be adjusted together to meet the customer's requirement. On the connector side, jack plating is silver and jack material is brass, T2 copper, also customizable.
The finger sees duty in new-energy electric vehicle charging connectors, covering the 3mm; 6mm pin jack family. The family's row-shaped deformation contacts support a long mating-service life, and the finger is linked to Electric Vehicles, High-Speed Rail, Energy Storage & Battery Testing and Industrial & Robotics applications. Plating and material options are finalized at quoting against the customer's drawing.
In the SISE catalog this finger is designed alongside the quick-plug and heavy-duty connector line used in electric vehicle chargers and high-voltage power battery packs, so it can be paired with mating hardware from the same family or engineered as a new bore against a fresh drawing.
Manufactured by Dongguan SISE (Spring-in-Spring) Electronics Co., Ltd., an ISO 9001 and IATF 16949 certified manufacturer of precision spring contacts, high-current connector terminals and EMI/RFI shielding since 2011.